Build-Up PWBs
This PWB is made of conductive layers that are connected by copper-plated laser via, the circuit density can be increased remarkably to reduce the size and thickness.
Density can be increased without reducing the reliability by employing interstitial via holes (IVH) and blind via holes (BVH).
Principal use
Communication equipment / The mobile terminal industry / Measuring equipment
Technology / Composition
High Modulus/Low CTE PWBs
Warp can be remarkably reduced because of the small XY-axis expansion coefficient and high coefficient of elasticity.
An environment with a large temperature change may cause cracks in solder joints due to differences in thermal expansion coefficients, which reduce connection reliability. To prevent this, the thermal expansion coefficient of the PWB must be reduced.
The thermal expansion coefficient can be reduced to as low as that of alumina ceramics or silicones.
Principal use
Servers / Routers / Measuring Instruments / Communication Equipment / Semiconductor Packages
Technology / Composition
Thin/Thick PWBs
Demand for thin PWBs has increased, mainly for mobile purposes.
We can supply thin PWBs that reduce warping during chip installation.
To install heavy parts or large chips on PWBs, we can supply thick PWBs that are made of highly elastic or low thermal expansion materials.
Principal use
Low-Profile Modules / Mobile Terminal Apparatus / Medical Equipment
Technology / Composition
Double-Sided/Multi-layer PWBs
This PWB is made of conductive layers that are connected via copper-plated through-holes.
From general-purpose to special-purpose products, you can achieve both low cost and high quality by selecting optimal materials to suit your purposes.
Principal use
Computers / Industrial Machinery / Measuring Instruments
Technology / Composition
Pin Terminal PWBs
We offer PWBs with leads. By mounting necessary components, we are able to produce modules that can be inserted into sockets. High thermal conductivity and large current can be supported with the copper pins.
Principal use
Sensors / Power Modules / Semiconductor Packages