We are able to form component pads (for mounting a component) just above a through-hole by filling a through-hole with resin to make the PWB surface flat.
The “VIA on VIA” structure is formed by applying this technique to the inner layer of a build-up PWB.
Choose epoxy type resin or conductive paste as the hole-plugging material.

Principal use

Multi-chip modules, build-up PWBs, and more



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Hours 8:30-17:30 (weekdays only)


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