High Modulus/Low CTE PWBs

Warp can be remarkably reduced because of the small XY-axis expansion coefficient and high coefficient of elasticity.

An environment with a large temperature change may cause cracks in solder joints due to differences in thermal expansion coefficients, which reduce connection reliability. To prevent this, the thermal expansion coefficient of the PWB must be reduced.

The thermal expansion coefficient can be reduced to as low as that of alumina ceramics or silicones.

Principal use

Servers / Routers / Measuring Instruments / Communication Equipment / Semiconductor Packages

Technology / Composition

High-Frequency PWBs

High-quality and high-speed signal processing in high-frequency signal circuits can be supported by combining our manufacturing technology with high-frequency materials for low dielectric constant, low dielectric tangent, and low transmission loss processing.

Principal use

Antennas / Radars / Automotive Sensors / Power Amplifiers

Technology / Composition

Build-Up PWBs

This PWB is made of conductive layers that are connected by copper-plated laser via, the circuit density can be increased remarkably to reduce the size and thickness.

Density can be increased without reducing the reliability by employing interstitial via holes (IVH) and blind via holes (BVH).

Principal use

Communication equipment / The mobile terminal industry / Measuring equipment

Technology / Composition

Double-Sided/Multi-layer PWBs

This PWB is made of conductive layers that are connected via copper-plated through-holes.

From general-purpose to special-purpose products, you can achieve both low cost and high quality by selecting optimal materials to suit your purposes.

Principal use

Computers / Industrial Machinery / Measuring Instruments

Technology / Composition

Heat Dissipating PWBs

High heat dissipation can be attained by using aluminum or copper plates in LED lights, power modules, and other products requiring such dissipation. Increasing the thermal conductivity of PWB suppresses rising temperatures in components and conductors.

Principal use

Power Modules / LED Devices / Electronic Car Devices

Technology / Composition

Printed Circuit Boards Manufacturing Menu

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