High Density Advanced Fine Pattern and Flip-chip Mounting PCB for Semiconductor Packages.

High-density advanced semiconductor packages are used in 5G/mobile communication equipment/server/FC-BGA. We enable us to produce low cost fine patterning by our own subtractive method technology. We add a direct imaging exposure system to the existing contact exposure system, it makes the pattern more high-density and high accuracy.

Flip-chip Mounting PCB

Design Rules

Fine 1(Direct imaging)Fine 2(Contact exposure)Standard
Pattern position accuracy(to through hole)±10μ±35μ±50μ
Solder resist position accuracy (to pattern)±30μ±50μ±75μ

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