High Density Advanced Fine Pattern and Flip-chip Mounting PCB for Semiconductor Packages.
High-density advanced semiconductor packages are used in 5G/mobile communication equipment/server/FC-BGA. We enable us to produce low cost fine patterning by our own subtractive method technology. We add a direct imaging exposure system to the existing contact exposure system, it makes the pattern more high-density and high accuracy.
|Fine 1(Direct imaging)
|Fine 2(Contact exposure)
|Pattern position accuracy(to through hole)
|Solder resist position accuracy (to pattern)