We will attend Nepcon Japan(IC & SENSOR PACKAGING TECHNOLOGY EXPO) on 19th-21th January, 2022.
Nepcon Japan is asia’s Leading exhibition for electronics R&D, manufacturing and packaging technology.
This time, we will display our new Double sided Flip-chip Mounting Cavity PCB for the first time, Ultra Thick Copper circuit substrate for power semiconductor and high density advanced printed circuit board achieved by our original technologies.
Also, we will introduce on-metal, non/on-metal, liquid container compatible UHF RFID Tag, and highlight will be the newest Energy Harvesting Sensor Tag.
Plus, we are planning to release online booth and prepare product information PDF download for who can not visit the expo.
Venue:Tokyo Big Sight, Japan
East Exhibition Hall 25-11
Welcome you to visit us Nihon Micron co., ltd.