We will attend Nepcon Japan(IC & SENSOR PACKAGING TECHNOLOGY EXPO) on 20th-22th January, 2021.
Nepcon Japan is asia’s Leading exhibition for electronics R&D, manufacturing and packaging technology
with 1,950 exhibitors.
This time, we will show our new flip chip mounting substrate by direct imaging exposure machine and thick copper circuit substrate for power semiconductor. And we will demonstrate on-metal UHF RFID tag system.
Also we are planning to release online booth and prepare product information PDF download for who can not visit the expo.
Venue:Tokyo Big Sight, Japan
West Exhibition Hall W11-32
Welcome you to visit us Nihon Micron co., ltd.